Method for fabricating three-dimensional microstructures and a h

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437225, 437238, 148DIG51, 156657, H01L 21302, H01L 21311

Patent

active

049487574

ABSTRACT:
A method for preferentially etching phosphosilicate glass to form a micromechanical structure includes forming a layer of phosphosilicate glass on a substrate and opening at least one via in the phosphosilicate glass layer. A layer of material which is patterned to produce a micromechanical structure is formed over the phosphosilicate glass layer which extends through the via and adheres to the substrate. The phosphosilicate glass layer is then removed by immersing the device in an etchant bath containing an aqueous ammoniacal hydrogen peroxide solution. The resulting micromechanical structure has at least one point of attachment to the substrate and is otherwise spaced apart from the substrate by an air gap. A method for attaching an overhanging mass to a miniature cantilever beam using microelectronics fabrication technology is also provided in which the center of gravity is shifted to the endpoint of the free end of the beam. There is further provided an integrated sensor which includes at least one micromechanical transducing structure and on-board detection circuitry which detects extremely small motions of the structure and produces a corresponding digital output.

REFERENCES:
patent: 3328649 (1967-06-01), Rindner et al.
patent: 3764820 (1973-10-01), White et al.
patent: 4264374 (1981-04-01), Beyer et al.
patent: 4478077 (1984-10-01), Bohrer et al.
patent: 4571661 (1986-02-01), Hoshino
patent: 4597003 (1986-06-01), Aine et al.
patent: 4665610 (1987-05-01), Barth
patent: 4670092 (1987-06-01), Motamedi
patent: 4706374 (1987-11-01), Murakami
Petersen, K. E., "Silicon as a Mechanical Material", Proceedings of the IEEE, vol. 70, No. 5, pp. 420-457, May 1982.
Kern, W. and Puotinen, D. C., "Cleaning Solutions Based on Hydrogen Peroxide for Use in Silicon Semiconductor Technology", RCA Review, pp. 187-205, Jun. 1970.
Petersen, K. E., Shartel, A. and Raley, N. F., "Micromechanical Accelerometer Integrated with MOS Detection Circuitry", IEEE Transactions on Electron Devices, vol. ED-29, No. 1, pp. 23-26, Jan. 1982.
Kern, W., "Purifying Si and SiO.sub.2 Surfaces with Hydrogen Peroxide", Semiconductor International, pp. 94-99, Apr. 1984.
Frobenius, W. D. et al., "Microminiature Ganged Threshold Accelerometers Compatible with Integrated Circuit Technology", IEEE Transactions on Electron Devices, vol. ED-19, No. 1, pp. 37-40, Jan. 1972.
Roylance, L. M. and Angell, J. B., "A Batch-Fabricated Silicon Accelerometer", Transactions on Electron Devices, vol. ED-26, No. 12, pp. 1911-1917, Dec. 1979.
Watanabe et al., "Etching . . . Process", Proceeding Electrochemical Society, 1983, pp. 488-496.
White, L. K., "Bilayer Taper Etching of Field Oxides and Passivation Layers", Journal of Electrochemical Society: Solid State Science and Technology, vol. 127, No. 12, pp. 2687-2693 (Dec. 1980).
Kern, W., "Densification of Vapor-Deposited Phosphosilicate Glass Films", RCA Review, vol. 37, pp. 55-77 (Mar. 1976).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating three-dimensional microstructures and a h does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating three-dimensional microstructures and a h, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating three-dimensional microstructures and a h will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-462858

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.