Method for fabricating thin, strong, and flexible die for smart

Details Method for fabricating thin, strong, and flexible die for smart Method for fabricating thin, strong, and flexible die for smart

1994-04-11

1996-01-02

Fourson, George

Fishing, trapping, and vermin destroying

437225, 437974, 257679, H01L 21304

Patent

active

054808421

ABSTRACT:
Improved methods for fabricating smart cards are disclosed. Semiconductor die approximately 0.004 to 0.007 inches thick are fabricated using chemical stress relief processes and UV dicing tape. The die are positioned substantially on the neutral axis of a smart card, thereby providing smart cards having improved resistance to mechanical flexure.

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