Method for fabricating thin film transistor

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257411, 437241, 437238, H01L 21336, H01L 2128

Patent

active

055003800

ABSTRACT:
The present invention relates to a method for fabricating an amorphous-silicon thin film transistor, which comprises the steps of forming a gate electrode having sloped edges on a substrate, depositing a silicon oxide film as a gate insulation film on the substrate on which the gate electrode is formed, performing a nitrogen plasma treatment process on the surface of the silicon oxide film to form a silicon nitride film at the surface of the gate insulation film and thus to form the gate insulation film completely, depositing an amorphous silicon film on the gate insulation film to form an active layer, depositing a n+ type amorphous silicon film over the entire exposed surface of the resulting structure to form an ohmic layer, etching the n+ type amorphous silicon film and the amorphous silicon film in this order to leave the n+ type amorphous silicon film and the amorphous silicon film only on a portion of the gate insulation layer, forming a source region and a drain region respectively only on portions of the n+ type amorphous silicon film corresponding to both edges of the gate electrode to expose the n+ type amorphous silicon film deposited between the source region and the drain region, removing the exposed portion of the n+ type amorphous silicon film, and forming a protection film over the whole surface of the substrate.

REFERENCES:
patent: 4905066 (1990-02-01), Dohjo et al.
patent: 5272360 (1993-12-01), Todoroki et al.
He et al., "Channel Layer Surface Modifications in a-Si:H Thin Film Transistors With Oxide/Nitride Dielectric Layers", Mat. Res. Soc. Symp. Proc. vol. 282, 1993, pp. 505-510.
Luan et al., "Effect of NH.sub.3 Plasma Treatment of Gate Nitride on the Performance of Amorphous Silicon Thin-Film Transistors", J. Appl. Phys., vol. 68, No. 7, 1 Oct. 1990, pp. 3445-3450.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating thin film transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating thin film transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating thin film transistor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1959141

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.