Method for fabricating thick film capacitive devices and the res

Stock material or miscellaneous articles – Composite – Of inorganic material

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428702, B32B 1700

Patent

active

060200804

ABSTRACT:
A fabrication process for producing thick film electrical components wherein capacitive and RC components may be provided with extremely low impedance by minimizing inadvertent inductance. The process relies on the use of thick film technology to deposit a plurality of distinct overlying flat layers of appropriate size, shape and materials on an underlying substrate. Use of relatively large area conductive films to form plates of a capacitor, results in a highly precise capacitance with virtually no inductive component. The process employs a series of print, dry and fire steps for each layer of screening on a substrate. The magnitude of the fabricated capacitance is based on the number of capacitor plates screened as well as the area of the plates, the thickness of the dielectric plate between the capacitor plates and the dielectric constant of the dielectric plate. In an RC component configuration, such as for a termination device, a plurality of thick film resistors is screened and laser trimmed to precisely match them to one another. Then an overcoat is provided to protect the various layers.

REFERENCES:
patent: 5561587 (1996-10-01), Sanada

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