Method for fabricating thick film alumina structures used in...

Details Method for fabricating thick film alumina structures used in... Method for fabricating thick film alumina structures used in...

2007-08-14

2007-08-14

Kianni, K. Cyrus (Department: 2883)

Optical waveguides

Integrated optical circuit

C385S147000, C029S424000

Reexamination Certificate

active

10462447

ABSTRACT:
A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

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patent: 5316985 (1994-05-01), Jean et al.
patent: 6909589 (2005-06-01), Huff
patent: 2004/0061234 (2004-04-01), Shah et al.
patent: 2005/0108875 (2005-05-01), Mathieu et al.
patent: 2005/0146039 (2005-07-01), Shah et al.
patent: 2005/0161826 (2005-07-01), Shah et al.
patent: 2005/0236180 (2005-10-01), Sarma et al.

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