Method for fabricating surface mountable chip inductor

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S605000, C029S608000, C336S192000, C336S233000

Reexamination Certificate

active

06918173

ABSTRACT:
In a method for fabricating a surface mountable chip inductor, a spiral coil pattern is formed on a surface of a cylindrical body fabricated by mixing ferrite or ceramic powder with thermoplastic organic binder, the cylindrical body is transformed into a square-shaped body by being inserted into a square-shaped mold and pressure being applied at a certain temperature. An electric characteristic lowering problem can be prevented by forming the coil on the cylindrical body, and transforming the cylindrical body into a square-shaped body to improve surface mounting.

REFERENCES:
patent: 4490706 (1984-12-01), Satou et al.
patent: 6070787 (2000-06-01), Harada et al.
patent: 6076253 (2000-06-01), Takayama et al.
patent: 6144280 (2000-11-01), Amada et al.
patent: 6154112 (2000-11-01), Aoba et al.
patent: 6189204 (2001-02-01), Shikama et al.
patent: 6377151 (2002-04-01), Takayama et al.
patent: 6393691 (2002-05-01), Ogawa et al.
patent: 2002/0151114 (2002-10-01), Kanetaka et al.
patent: 11-121234 (1999-04-01), None
patent: 11-154610 (1999-06-01), None
patent: 2000-036414 (2000-02-01), None
Office Action issued by Japanese Patent Office on Jul 31, 2003 in prosecution of corresponding Jananese Patent Application No. 2001-231073 (untranslated).
English translation of Abstract for Japanese Patent No. 2000-036414.
English translation of Abstract for Japanese Patent No. 11-154610.
English translation of Abstract for Japanese Patent No. 11-121234.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating surface mountable chip inductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating surface mountable chip inductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating surface mountable chip inductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3396490

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.