Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-05-16
2006-05-16
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S114000, C438S115000, C438S113000, C438S110000, C257S659000, C257S660000
Reexamination Certificate
active
07045385
ABSTRACT:
A method for fabricating Surface Acoustic Wave filter packages uses a package sheet having an outline pattern and anti-bur holes. In the package sheet for a Surface Acoustic Wave filter package, the outline pattern is formed along outer peripheries of chip mounting areas where a plurality of SAW filter chips are to be mounted. The outline pattern is contacted with a metal shield layer formed on the SAW filter chips and a predetermined region of the package sheet. Circular anti-bur holes are located at the corners of the chip mounting areas and on cutting lines along which the sheet is to be singulated into individual SAW filter packages.
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Jeon Moon Soo
Kim Tae Hoon
Park Joo Hun
Seo Ju Weon
Lowe Hauptman & Berner LLP
Samsung Electro-Mechanics Co. Ltd.
Thai Luan
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