Method for fabricating surface acoustic wave filter package

Details Method for fabricating surface acoustic wave filter package Method for fabricating surface acoustic wave filter package

2005-08-16

2005-08-16

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025350, C029S832000, C029S841000, C438S108000, C438S112000, C438S121000, C174S050510, C361S730000, C361S816000, C427S427100, C264S272110

Reexamination Certificate

active

06928719

ABSTRACT:
A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.

REFERENCES:
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 6329739 (2001-12-01), Sawano
patent: 6492194 (2002-12-01), Bureau et al.
patent: 1 313 217 (2003-05-01), None
patent: 11-150440 (1999-06-01), None
patent: 58-137235 (2004-11-01), None
patent: 2001-0042496 (2001-05-01), None

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