Metal fusion bonding – Process – With shaping
Patent
1981-09-11
1984-11-20
Lin, Kuang Y.
Metal fusion bonding
Process
With shaping
228265, 228193, 228205, B23K 3102
Patent
active
044834780
ABSTRACT:
A method for fabricating superplastically formed/diffusion bonded structures wherein metal blanks of aluminum or an aluminum alloy having an oxide surface layer are joined at selected areas by diffusion bonding and expanded superplastically to form a desired sandwich or integrally stiffened structure. According to such method, a suitable mask is applied to selected areas of the aluminum or aluminum alloy blanks. The assembly is then placed in a vacuum chamber and at a suitable low pressure and suitable voltage a glow discharge is created between the metal blank or blanks functioning as cathode or sputtering target, and an anode to selectively remove the oxide from the metal blanks and deposit the oxide debris on the anode. After the oxide layers have been removed from the surfaces of the blanks to be bonded, such surfaces are brought into intimate contact within the sputtering chamber or in an area equipped with heated platens, and while preventing reoxidation of the cleaned surface areas of the metal blanks, such blanks are subjected to press pressure and heat. The cleaned oxide-free areas bond, while the remaining areas, protected by the natural oxide and covered by the masks, do not bond. Such masks can be removed after sputtering and either prior to or during die bonding. If desired, the aluminum or aluminum alloy blanks can be initially anodized, to provide a thicker bond resistant oxide layer. The die bonded metal blanks are then subjected to superplastic forming in known manner to fabricate an integrally stiffened or sandwich structure.
REFERENCES:
patent: 1196118 (1916-08-01), Klauber
patent: 3500532 (1980-08-01), Lozano et al.
patent: 3927817 (1975-12-01), Hamilton et al.
patent: 3937387 (1976-02-01), Fletcher et al.
patent: 4070264 (1978-01-01), Loiseau et al.
patent: 4087037 (1978-05-01), Schier et al.
patent: 4113486 (1978-09-01), Sato
patent: 4148705 (1979-04-01), Battey et al.
patent: 4220276 (1980-09-01), Weisert et al.
patent: 4222838 (1980-09-01), Bhagat et al.
patent: 4307179 (1981-12-01), Chang et al.
patent: 4348577 (1982-09-01), Joyoda et al.
patent: 4349409 (1982-09-01), Shiboyama et al.
patent: 4361262 (1982-11-01), Israeli
patent: 4373990 (1983-02-01), Porter
N. E. Paton, "Interdisciplinary Program for Quantitative Flaw Definition, Special Report, Second Year Effort", for period of 7/1/75-4/30/76, pp. 96, 100 and 101.
Geldin Max
Jordan M.
Lin Kuang Y.
Rockwell International Corporation
Silberberg Charles T.
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