Method for fabricating superconductor packages

Details Method for fabricating superconductor packages Method for fabricating superconductor packages

1991-04-04

1993-06-01

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, 264 65, 264 66, C04B 3700

Patent

active

052156109

ABSTRACT:
A method for promoting adhesion of cofired copper-based metallurgy and glass ceramic dielectric materials. The method includes the step of adding powder of an alloying metal to the copper based metallurgy prior to firing. A paste which exhibits superior adhesion to glass ceramics includes an organic carrier, copper powder, and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

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