Method for fabricating sputter targets

Details Method for fabricating sputter targets Method for fabricating sputter targets

2008-01-01

2008-01-01

Meeks, Timothy (Department: 1762)

Coating processes

Immersion or partial immersion

Metal base

C427S443100, C427S437000, C204S192100

Reexamination Certificate

active

07314650

ABSTRACT:
Sputter targets comprising a target backing plate and a target deposit, are manufactured using electroless and electrolytic deposition of metal and metal alloys on a surface of the target backing plate. Portions of the target backing plate other than the surface can be protected from the deposition process. In addition, sputter targets comprising a target backing plate and a target deposit with complex combinations of materials are manufactured by simultaneous electroless deposition of a matrix metal and particulate material.

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