Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-01-02
2010-02-02
Pizarro, Marcos D. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S123000, C438S127000, C257SE21499
Reexamination Certificate
active
07655503
ABSTRACT:
A semiconductor package with stacked chips and a method for fabricating the same are proposed. The semiconductor package includes a lead frame having a plurality of leads and supporting extensions; at least one preformed package having an active surface, and a non-active surface attached to the supporting extensions of the lead frame; at least one chip mounted on the active surface of the preformed package; a plurality of bonding wires for electrically interconnecting the lead frame, the preformed package and the chip; and an encapsulant for encapsulating the preformed package, the chip, the bonding wire and a portion of the lead frame. The active surface of the preformed package serves for carrying the chip and can be used as a wire jumper, so as to solve a known good die (KGD) problem of a multi-chip module.
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Chang Chin-Huang
Huang Jung-Pin
Liu Chung-Lun
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Pizarro Marcos D.
Siliconware Precision Industries Co. Ltd.
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