Method for fabricating semiconductor package and...

Details Method for fabricating semiconductor package and... Method for fabricating semiconductor package and...

2006-05-23

2006-05-23

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

Reexamination Certificate

active

07049178

ABSTRACT:
A method of fabricating a semiconductor package is disclosed in which a first Ni—Au plating is formed on a bonding pad for connection with a semiconductor chip, without a mechanical process or a masking operation. The method applies a copper plating on a through bore and the bonding pad, where the copper plated layer formed on the bonding pad is selectively removed, and then a second Ni—Au plating is formed on the bonding pad and a ball pad.

REFERENCES:
patent: 5804422 (1998-09-01), Shimizu et al.
patent: 6074567 (2000-06-01), Kuraishi et al.
patent: 6582616 (2003-06-01), Kang et al.

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