Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-04-29
2008-04-29
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S106000, C438S123000, C438S124000, C438S127000, C257SE21001
Reexamination Certificate
active
11649422
ABSTRACT:
A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.
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Chen Chun-Lung
Lai Jeng-Yuan
Corless Peter F.
Jensen Steven M.
Lebentritt Michael
Roman Angel
Siliconware Precision Industries Co. Ltd.
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