Method for fabricating semiconductor memory device

Fishing – trapping – and vermin destroying

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437 48, 437 52, 437984, H01L 2128

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active

053366280

ABSTRACT:
An improved integrated circuit and fabrication method for forming the improved integrated circuit is described. The method includes an anisotropic etching, without the use of either masks or photolithography, which removes insulating material from contact openings, but keeps insulating material on the sides of conductive layers, preventing inadvertent short circuits from the contact openings to the conductive layers. The maskless etching method makes it possible to avoid mask-wafer alignment errors and therefore frees designers to perfectly center contact openings within insulative regions without taking into account the surface area tolerances required under prior art fabrication methods. This freedom allows designers to design more highly integrated devices. The particular embodiments of the semiconductor integrated circuit may include floating gates (47) and control gates (52) covered with an upper oxide layer (53) on which electrical connection lines (11) have been installed.

REFERENCES:
patent: 4707717 (1987-11-01), Hirabayashi et al.
patent: 4768080 (1988-08-01), Sato
patent: 4851365 (1989-07-01), Jeuch et al.
patent: 4935380 (1990-06-01), Okumura
patent: 5107313 (1992-04-01), Kohda et al.

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