Method for fabricating semiconductor device with recess gate

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S701000, C438S589000

Reexamination Certificate

active

07989350

ABSTRACT:
A method for fabricating a semiconductor device includes forming a structure including a sacrificial layer and a hard mask over a substrate, performing a plasma treatment over the structure including the hard mask to form a protective layer over the hard mask, etching the sacrificial layer using the protective layer as an etch barrier, and etching the substrate using the protective layer and the patterned sacrificial layer as an etch barrier to form a recess pattern.

REFERENCES:
patent: 5780338 (1998-07-01), Jeng et al.
patent: 6475888 (2002-11-01), Sohn
patent: 6613682 (2003-09-01), Jain et al.
patent: 6790770 (2004-09-01), Chen et al.
patent: 6878646 (2005-04-01), Tsai et al.
patent: 7037850 (2006-05-01), Lee et al.
patent: 7151040 (2006-12-01), Tran et al.
patent: 7442648 (2008-10-01), Kim et al.
patent: 7485557 (2009-02-01), Han et al.
patent: 7563688 (2009-07-01), Sun et al.
patent: 7629242 (2009-12-01), Han et al.
patent: 7749912 (2010-07-01), Kim et al.
patent: 2002/0160592 (2002-10-01), Sohn
patent: 2004/0072446 (2004-04-01), Liu et al.
patent: 2004/0198065 (2004-10-01), Lee et al.
patent: 2006/0079093 (2006-04-01), Kim et al.
patent: 2007/0099384 (2007-05-01), Han et al.
patent: 2007/0123014 (2007-05-01), Han et al.
patent: 2007/0202657 (2007-08-01), Sun et al.
patent: 2008/0081447 (2008-04-01), Jang et al.
patent: 2008/0160769 (2008-07-01), Kim
patent: 2009/0263972 (2009-10-01), Balseanu et al.
patent: 1020050106878 (2005-11-01), None
patent: 1020060113830 (2006-11-01), None
patent: 1020060114447 (2006-11-01), None
Notice of Allowance for Korean Application 10-2006-0134296.

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