Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2011-08-02
2011-08-02
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S701000, C438S589000
Reexamination Certificate
active
07989350
ABSTRACT:
A method for fabricating a semiconductor device includes forming a structure including a sacrificial layer and a hard mask over a substrate, performing a plasma treatment over the structure including the hard mask to form a protective layer over the hard mask, etching the sacrificial layer using the protective layer as an etch barrier, and etching the substrate using the protective layer and the patterned sacrificial layer as an etch barrier to form a recess pattern.
REFERENCES:
patent: 5780338 (1998-07-01), Jeng et al.
patent: 6475888 (2002-11-01), Sohn
patent: 6613682 (2003-09-01), Jain et al.
patent: 6790770 (2004-09-01), Chen et al.
patent: 6878646 (2005-04-01), Tsai et al.
patent: 7037850 (2006-05-01), Lee et al.
patent: 7151040 (2006-12-01), Tran et al.
patent: 7442648 (2008-10-01), Kim et al.
patent: 7485557 (2009-02-01), Han et al.
patent: 7563688 (2009-07-01), Sun et al.
patent: 7629242 (2009-12-01), Han et al.
patent: 7749912 (2010-07-01), Kim et al.
patent: 2002/0160592 (2002-10-01), Sohn
patent: 2004/0072446 (2004-04-01), Liu et al.
patent: 2004/0198065 (2004-10-01), Lee et al.
patent: 2006/0079093 (2006-04-01), Kim et al.
patent: 2007/0099384 (2007-05-01), Han et al.
patent: 2007/0123014 (2007-05-01), Han et al.
patent: 2007/0202657 (2007-08-01), Sun et al.
patent: 2008/0081447 (2008-04-01), Jang et al.
patent: 2008/0160769 (2008-07-01), Kim
patent: 2009/0263972 (2009-10-01), Balseanu et al.
patent: 1020050106878 (2005-11-01), None
patent: 1020060113830 (2006-11-01), None
patent: 1020060114447 (2006-11-01), None
Notice of Allowance for Korean Application 10-2006-0134296.
Hynix / Semiconductor Inc.
Lowe Hauptman & Ham & Berner, LLP
Menz Laura M
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