Method for fabricating semiconductor device having capacitor

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S700000, C438S723000

Reexamination Certificate

active

07396772

ABSTRACT:
A method for fabricating a semiconductor device includes: providing a substrate structure including a bit line and a capacitor formed apart from each other at a different level; forming first, second, and third insulation layers over the bit line, the second insulation layer being a first etch stop layer; forming a second etch stop layer over a top electrode of the capacitor; forming a fourth insulation layer over the third insulation layer and the second etch stop layer; and performing a plurality of etch steps to expose an upper surface of the bit line and an upper surface of the capacitor.

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patent: 2001/0046737 (2001-11-01), Ahn et al.
patent: 2002/0119623 (2002-08-01), Park et al.
patent: 2005/0048717 (2005-03-01), Ito et al.
patent: 2006/0211192 (2006-09-01), Cho et al.
patent: 1999-0055805 (1999-07-01), None
patent: 100233559 (1999-09-01), None
patent: 1020000072953 (2000-12-01), None
patent: 1020010057669 (2001-07-01), None

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