Method for fabricating semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 41DM, 437 44, 437 70, 437 72, H01L 21265

Patent

active

056863276

ABSTRACT:
A method for fabricating a semiconductor device, capable of forming an element-isolating insulating film for MOS transistors in a self-aligned manner during formation of the MOS transistors on a substrate, thereby simplifying the fabrication of the semiconductor device. The substrate is vertically etched to form a protruded portion thereof. By the vertical height of the protruded substrate portion, the gate length of each corresponding MOS transistor can be adjusted. This results in an improvement in the integration degree of the semiconductor device. Accordingly, it is possible to easily apply the least design method to design of highly integrated semiconductor devices.

REFERENCES:
patent: 3993513 (1976-11-01), O'Brien
patent: 4366613 (1983-01-01), Ogura et al.
patent: 5021355 (1991-06-01), Dhong et al.
patent: 5087581 (1992-02-01), Rodder
patent: 5089865 (1992-02-01), Mitsui et al.
patent: 5132238 (1992-07-01), Murakami et al.
patent: 5177027 (1993-01-01), Lowrey et al.
patent: 5494837 (1996-02-01), Subramanian et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1228371

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.