Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2011-08-16
2011-08-16
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C257SE21014
Reexamination Certificate
active
07998825
ABSTRACT:
A method for fabricating a semiconductor device includes: forming an etch stop pattern over a conductive layer, the etch stop pattern having a first opening exposing a top surface of the conductive layer; forming an insulation layer over the etch stop pattern; selectively etching the insulation layer to form a second opening exposing the top surface of the conductive layer; and enlarging the second opening until the etch stop pattern is exposed.
REFERENCES:
patent: 6287961 (2001-09-01), Liu et al.
patent: 6583056 (2003-06-01), Yu et al.
patent: 6740584 (2004-05-01), Eimori
patent: 7132326 (2006-11-01), Lee et al.
patent: 100388682 (2003-06-01), None
patent: 100434496 (2004-05-01), None
patent: 100534100 (2005-11-01), None
patent: 100672816 (2007-01-01), None
Korean Notice of Allowance for Korean application No. 10-2008-0046973, Feb. 2010.
Chinese Office Action for application No. 200910007223.X, Aug. 2010.
Park Jong-Bum
Park Jong-Kook
Song Han-Sang
Hynix / Semiconductor Inc.
Lowe Hauptman & Ham & Berner, LLP
Shook Daniel
Smith Matthew
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