Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2011-08-09
2011-08-09
Deo, Duy-Vu N (Department: 1713)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S707000, C438S708000, C438S709000, C438S710000, C438S725000
Reexamination Certificate
active
07994065
ABSTRACT:
A method for fabricating a semiconductor device includes stacking a spin on carbon (SOC) layer and an multifunction hard mask (MFHM) layer on a substrate, forming a photoresist pattern over the MFHM layer, first etching the MFHM layer using a first amount of a fluorine-based gas, second etching the MFHM layer using a second amount of a fluorine-based gas, wherein the second amount is less than the first amount, etching the SOC layer using the MFHM layer as an etch barrier, and etching the substrate using the SOC layer and the MFHM layer as an etch barrier.
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Park Sang-Soo
Shin Su-Bum
Deo Duy-Vu N
Hynix / Semiconductor Inc.
Kilpatrick Townsend & Stockton LLP
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