Method for fabricating semiconductor device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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Details

C438S066000, C438S067000, C257S432000, C257S433000, C257S434000, C257SE25032

Reexamination Certificate

active

10498373

ABSTRACT:
A method for fabricating a semiconductor device, comprising the steps of: forming an element on a silicon substrate; packaging the element; and annealing the packaged element before its transportation or long-term storage.

REFERENCES:
patent: 5334829 (1994-08-01), Ueno et al.
patent: 6046070 (2000-04-01), Shoji et al.
patent: 61-013652 (1986-01-01), None
patent: 05-206423 (1993-08-01), None
patent: 08-018025 (1996-01-01), None
patent: 09-135011 (1997-05-01), None
patent: 2001-250188 (2001-09-01), None
Translation of the International Preliminary Examination Report mailed Mar. 22, 2004 in corresponding PCT Application No. PCT/JP2002/012938.

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