Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-05-09
2006-05-09
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S110000, C438S239000, C438S393000
Reexamination Certificate
active
07041537
ABSTRACT:
A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the die. The capacitor includes a first electrode in electrical communication with a first terminal contact for the component, and a second electrode in electrical communication with a second terminal contact for the component. The electrodes are separated by a dielectric layer and protected by an outer protective layer of the component. The capacitor can be fabricated using redistribution layers on a wafer containing multiple dice. The component can be used to construct systems such as multi chip packages and multi chip modules.
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Akram Salman
Brooks Mike
Gratton Stephen A.
Trinh Michael
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