Method for fabricating semiconductor component

Details Method for fabricating semiconductor component Method for fabricating semiconductor component

2006-10-10

2006-10-10

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Making passive device

C438S381000, C438S387000, C361S303000

Reexamination Certificate

active

07118984

ABSTRACT:
Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.

REFERENCES:
patent: 3379568 (1968-04-01), Holmes
patent: 3626081 (1971-12-01), Little
patent: 4044222 (1977-08-01), Kestenbaum
patent: 4258468 (1981-03-01), Balde
patent: 4938995 (1990-07-01), Giordano et al.
patent: 5023750 (1991-06-01), Hirayama
patent: 5079069 (1992-01-01), Howard et al.
patent: 5080958 (1992-01-01), Patterson et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5214000 (1993-05-01), Chazan et al.
patent: 5323520 (1994-06-01), Peters et al.
patent: 5509200 (1996-04-01), Frankeny et al.
patent: 5509553 (1996-04-01), Hunter et al.
patent: 5530288 (1996-06-01), Stone
patent: 5538433 (1996-07-01), Arisaka
patent: 5745335 (1998-04-01), Watt
patent: 5854534 (1998-12-01), Beilin et al.
patent: 5872695 (1999-02-01), Fasano et al.
patent: 5909633 (1999-06-01), Haji et al.
patent: 5917229 (1999-06-01), Nathan et al.
patent: 6071809 (2000-06-01), Zhao
patent: 6072690 (2000-06-01), Farooq et al.
patent: 6106627 (2000-08-01), Yializis
patent: 6331347 (2001-12-01), Haji
patent: 0 147 696 (1985-07-01), None
patent: 0 193 820 (1986-09-01), None
patent: 0 455 496 (1991-11-01), None
patent: 2 141 142 (1984-12-01), None
patent: 63-72108 (1988-04-01), None
patent: 63-76310 (1988-04-01), None
patent: 4-242908 (1992-08-01), None
patent: 5-47586 (1993-02-01), None
patent: 5-343262 (1993-12-01), None
patent: 6-140764 (1994-05-01), None
patent: 8-236898 (1996-09-01), None
patent: 10-237623 (1998-09-01), None
patent: 1-270849 (1998-10-01), None
patent: 10-270849 (1998-10-01), None
patent: 11-97289 (1999-04-01), None

Affiliated with

Also associated with

Rating

Method for fabricating semiconductor component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating semiconductor component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating semiconductor component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3685845