Method for fabricating self-aligned semiconductor devices

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 28, 437 89, 437 91, 437162, 437909, 437112, 437924, 148DIG27, 148DIG29, 148DIG43, 148DIG124, H01L 2120, H01L 21331

Patent

active

050616447

ABSTRACT:
A method of forming a self-aligned contact to a transistor component located on a semiconductor substrate comprising forming a transistor component opening in a masking layer overlying a semiconductor substrate and using epitaxial lateral overgrowth to form a self-aligned contact, the epitaxial overgrowth beginning in the masking layer opening at an upper surface of the semiconductor substrate and extending normal to and laterally over the masking layer surface.

REFERENCES:
patent: 3746908 (1973-07-01), Engeler
patent: 4190949 (1980-03-01), Ikeda et al.
patent: 4269631 (1981-05-01), Anantha et al.
patent: 4507158 (1985-03-01), Kamins et al.
patent: 4508579 (1985-04-01), Goth et al.
patent: 4522662 (1985-06-01), Bradbury et al.
patent: 4551394 (1985-11-01), Betsch et al.
patent: 4566914 (1986-01-01), Hall
patent: 4578142 (1986-03-01), Corboy, Jr. et al.
patent: 4637127 (1987-01-01), Kurogi et al.
patent: 4651407 (1987-03-01), Bencuya
patent: 4716128 (1987-12-01), Schubert et al.
patent: 4829016 (1989-05-01), Neudeck

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating self-aligned semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating self-aligned semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating self-aligned semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1400280

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.