Method for fabricating self-aligned semiconductor component

Fishing – trapping – and vermin destroying

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437 31, 437186, 148DIG10, 148DIG11, H01L 21225

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056704178

ABSTRACT:
A self-aligned semiconductor component (10) includes a layer (14) having two openings (36, 38) and overlying a doped region (13) in a substrate (11). One (36) of the two openings (36, 38) is used to self-align a different doped region (22) and a portion (27) of an electrode (27, 31). The electrode (27, 31) has another portion (31) overlying the self-aligned portion (27) to increase the current carrying capacity of the electrode (27, 31). A different electrode is formed in the other one (38) of the two openings (36, 38) and has a smaller current carrying capacity than the other electrode (27, 31).

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