Method for fabricating randomly oriented aluminum alloy sputteri

Details Method for fabricating randomly oriented aluminum alloy sputteri Method for fabricating randomly oriented aluminum alloy sputteri

1996-11-05

1998-06-16

Simmons, David A.

Metal treatment

Process of modifying or maintaining internal physical...

Heating or cooling of solid metal

148698, 148699, 148518, 148523, 148535, 205640, 205704, 204192, C22C 2100

Patent

active

057663807

ABSTRACT:
A method of fabricating an alloy sputtering target having fine precipitates of the second phase material and small, randomly oriented and uniform grains. The new method includes solution treatment to minimize second-phase precipitate size, cryo-deformation to prevent the formation of cubic structures and recrystallization to generate fine uniform grain sizes having a random orientation.

REFERENCES:
patent: 4159217 (1979-06-01), Selinas et al.
patent: 5087297 (1992-02-01), Pouliquen
patent: 5160388 (1992-11-01), Legresy et al.
patent: 5268236 (1993-12-01), Dumont et al.
patent: 5456815 (1995-10-01), Fukuyo et al.
J. Vac. Sci Technol. A 5(4), Crystallographic target effects in magnetron sputtering, C. E. Wickersham, Jr., Jul./Aug. 1987.

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