Method for fabricating protective caps for protecting...

Details Method for fabricating protective caps for protecting... Method for fabricating protective caps for protecting...

2005-12-13

2008-08-12

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S455000, C438S121000, C438S700000, C257S704000, C257SE23181

Reexamination Certificate

active

07410886

ABSTRACT:
A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein the location of each cavity corresponds to each of the devices on the wafer surface; and (c) forming a protective cap in each cavity and forming a plurality of bonding media around the cavities.

REFERENCES:
patent: 6777263 (2004-08-01), Gan et al.
patent: 7045868 (2006-05-01), Ding et al.
patent: 7138293 (2006-11-01), Ouellet et al.
patent: 7160476 (2007-01-01), Weekamp
patent: 2004/0099917 (2004-05-01), Greathouse et al.
patent: 2005/0168306 (2005-08-01), Cohn et al.

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