Method for fabricating printed circuit board having...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S025420, C029S840000, C029S852000, C156S089120, C438S253000

Reexamination Certificate

active

07908744

ABSTRACT:
A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric layer, and a carrier board sequentially provided thereon with a second metal layer, a high dielectric material layer, and a third wiring layer with a plurality of first electrode plates thereon; laminating the core board, second dielectric layer, and carrier board to one another; removing the carrier board so as to expose the second metal layer; and patterning the second metal layer so as to form a fifth wiring layer having a plurality of second electrode plates and a plurality of second conductive vias electrically connected to the third wiring layer, thereby allowing the first electrode plates, high dielectric material layer, and second electrode plates together to form a plurality of capacitance components.

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patent: 2010/0060381 (2010-03-01), Das et al.

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