Method for fabricating phase shift mask comprising a polymethylm

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430311, 430313, 430322, G03F 900

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056374259

ABSTRACT:
A method for fabricating a highly reliable phase shift mask, comprising the steps of: forming a phase shifting film and a screen on a transparent substrate, in sequence; forming an impurity layer on the screen; diffusing the impurities of the impurity layer selectively into the screen; removing the regions of the screen which are free of impurities; and selectively removing the phase shifting film. By virtue of using inorganic resist for screen, the method can be executed at low temperatures and a distortion of mask substrate can be prevented. Next, the vertical side wall of the shifter can be accomplished with ease owing to the high etch selectivity of the screen. In addition, the shifter beneath the screen offsets the bad affect resulting from the topology of the shifter, improving the effect of phase shift.

REFERENCES:
patent: 5194346 (1993-03-01), Rolfson et al.
patent: 5322749 (1994-06-01), Han
patent: 5358808 (1994-10-01), Nitayama et al.
Levenson et al., "Improving Resolution in Photolithography with a Phase-Shifting Mask", IEEE Transactions on Electron Devices, vol. ED-29, No. 12, Dec. 1982.
Polasko et al., "Deep UV Exposure of Ag.sub.2 Se/GeSe.sub.2 Utilizing an Excimer Laser", IEEE Electron Device Letters, vol. EdL-5, No. 1, Jan. 1984.
Hanyu et al., "New Phase-Shifting mask with Highly Transparent SiO.sub.2 Phase Shifters", SPIE vol. 1264 Optical/Laser Microlithography III (1990).
Yoshikawa et al., "A New Inorganic Electron Resist of High Contrast", Applied Physics Letters, vol. 31, No. 3, 1 Aug. 1977.

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