Method for fabricating package structures for optoelectronic...

Details Method for fabricating package structures for optoelectronic... Method for fabricating package structures for optoelectronic...

2009-03-27

2010-11-02

Doan, Theresa T (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S458000, C257S620000, C257S621000

Reexamination Certificate

active

07824964

ABSTRACT:
A package structure for an optoelectronic device. The package structure comprises a device chip reversely disposed on a first substrate, which comprises a second substrate and a first dielectric layer between the first and second substrates. The first dielectric layer comprises a pad formed in a corner of the first dielectric layer non-overlapping the second substrate, such that the surface and sidewall of the pad are exposed. A metal layer is formed directly on the exposed surface of the pad and covers the second substrate. A protective layer covers the metal layer, having an opening to expose a portion of the metal layer on the second substrate. A solder ball is disposed in the opening, electrically connecting to the metal layer. The invention also discloses a method for fabricating the same.

REFERENCES:
patent: 2006/0033198 (2006-02-01), Noma et al.
patent: 2006/0079019 (2006-04-01), Kim
patent: 2007/0026639 (2007-02-01), Noma et al.
patent: 2008/0128914 (2008-06-01), Morita et al.
patent: 2008/0283951 (2008-11-01), Nabe et al.

Affiliated with

Also associated with

Rating

Method for fabricating package structures for optoelectronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating package structures for optoelectronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating package structures for optoelectronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4191628