Method for fabricating optical devices by assembling...

Details Method for fabricating optical devices by assembling... Method for fabricating optical devices by assembling...

2008-04-22

2008-04-22

Doan, Jennifer (Department: 2874)

Optical waveguides

With optical coupler

Particular coupling structure

C385S015000, C385S140000

Reexamination Certificate

active

11603560

ABSTRACT:
An optical device comprises a first substrate wafer with at least one buried optical waveguide on an approximately flat planar surface of the substrate and a second substrate wafer with at least a second buried optical waveguide. The waveguides so formed may be straight or curved along the surface of the wafer or curved by burying the waveguide at varying depth along its length. The second wafer is turned (flipped) and bonded to the first wafer in such a manner that the waveguides, for example, may form an optical coupler or may cross over one another and be in proximate relationship along a region of each. As a result, three-dimensional optical devices are formed avoiding the convention techniques of layering on a single substrate wafer.

REFERENCES:
patent: 4896932 (1990-01-01), Cassidy
patent: 5657148 (1997-08-01), Feuer et al.
patent: 7085454 (2006-08-01), Feuer et al.

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