Method for fabricating optical device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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Details

C438S069000, C438S070000, C257SE21211, C257SE31127

Reexamination Certificate

active

08039286

ABSTRACT:
A method for fabricating an optical device includes providing a semiconductor substrate having an element region and a peripheral region. The element region has an element array comprised of semiconductor elements formed therein. The peripheral region has at least a bonding pad electrically connected to the element array. A dielectric layer with an opening exposing the bonding pad is formed over the semiconductor substrate. A filter array and a planarizing layer are sequentially formed on the dielectric layer, and an organic layer is filled into the opening. An inorganic layer is formed on the planarizing layer and covers the organic layer. A portion of the inorganic layer and the organic layer are sequentially removed until the bonding pad is exposed. The organic layer protects the bonding pad from corrosion during the step removing the inorganic layer, and thus the fabrication yield is improved.

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patent: 7678604 (2010-03-01), Kim
patent: 2004/0002178 (2004-01-01), Fasen et al.
patent: 2008/0111159 (2008-05-01), Gambino et al.

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