Method for fabricating multiple electronic devices within a sing

Details Method for fabricating multiple electronic devices within a sing Method for fabricating multiple electronic devices within a sing

1991-05-28

1992-05-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437215, 437218, 437220, 357 70, 357 75, H01L 2160

Patent

active

051148803

ABSTRACT:
The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.

REFERENCES:
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4791472 (1988-12-01), Okikawa et al.
patent: 4801997 (1989-01-01), Ono et al.
patent: 4837184 (1989-06-01), Lin et al.
patent: 4897602 (1990-01-01), Lin et al.
patent: 5023202 (1991-06-01), Long et al.

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