Method for fabricating multilayer circuits

Details Method for fabricating multilayer circuits Method for fabricating multilayer circuits

1989-11-17

1991-04-09

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156286, 29851, 264 58, 264 65, B32B 3126

Patent

active

050061828

ABSTRACT:
A method for fabricating multilayer circuits comprising patterned conductive layers separated by dielectric layers and connected by vias in the dielectric, wherein the unfired dielectric layers are laminated as tapes or sheets over either a fired or unfired conductor layer while under a vacuum.

REFERENCES:
patent: 4654095 (1987-03-01), Steinberg
patent: 4655864 (1987-04-01), Rellick
patent: 4806188 (1989-02-01), Rellick
patent: 4867935 (1989-09-01), Morrison, Jr.
patent: 4927733 (1990-05-01), Stout

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