Method for fabricating multilayer circuits

Details Method for fabricating multilayer circuits Method for fabricating multilayer circuits

1988-03-04

1989-02-21

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29851, 29852, 174 685, 264 58, 264 61, 264 67, 156253, B32B 3116

Patent

active

048061883

ABSTRACT:
The invention is directed to a method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes while maintaining excellent X-Y dimensional stability.

REFERENCES:
patent: 3770529 (1973-11-01), Anderson
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4504339 (1985-03-01), Kamehara et al.
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4649125 (1987-03-01), Takeuchi et al.
patent: 4654095 (1987-03-01), Steinberg
patent: 4655864 (1987-04-01), Rellick

Affiliated with

Also associated with

Rating

Method for fabricating multilayer circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating multilayer circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating multilayer circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1519849