Method for fabricating module of semiconductor chip

Details Method for fabricating module of semiconductor chip Method for fabricating module of semiconductor chip

2008-03-25

2008-03-25

Fourson, George R. (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S613000, C257SE21237

Reexamination Certificate

active

11291383

ABSTRACT:
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump; performing a grinding process on a rear surface of the substrate to reduce a thickness of the substrate; and exposing the bump by removing the protection layer.

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