Method for fabricating module of semiconductor chip

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate

Reexamination Certificate

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C438S613000, C257SE21237

Reexamination Certificate

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11291383

ABSTRACT:
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump; performing a grinding process on a rear surface of the substrate to reduce a thickness of the substrate; and exposing the bump by removing the protection layer.

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