Method for fabricating module of semiconductor chip

Details Method for fabricating module of semiconductor chip Method for fabricating module of semiconductor chip

2008-03-25

2008-03-25

Fourson, George R. (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S613000, C257SE21237

Reexamination Certificate

active

07348262

ABSTRACT:
A method for fabricating a module of a semiconductor chip is provided. The method includes the steps of: forming a bump on a substrate provided with a pad; forming a protection layer over the bump; performing a grinding process on a rear surface of the substrate to reduce a thickness of the substrate; and exposing the bump by removing the protection layer.

REFERENCES:
patent: 6281106 (2001-08-01), Higdon et al.
patent: 6699735 (2004-03-01), Ohuchi et al.
patent: 6753238 (2004-06-01), Kurita
patent: 6756184 (2004-06-01), Peng et al.
patent: 6756294 (2004-06-01), Chen et al.
patent: 2003/0099907 (2003-05-01), Tei et al.
patent: 2005/0218497 (2005-10-01), Komuro
patent: 2006/0128135 (2006-06-01), Lin
patent: 2007/0045871 (2007-03-01), Lee
patent: 2003-168664 (2003-06-01), None

Affiliated with

Also associated with

Rating

Method for fabricating module of semiconductor chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating module of semiconductor chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating module of semiconductor chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2800852