Method for fabricating microwave heterojunction bipolar transist

Fishing – trapping – and vermin destroying

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437 60, 437126, 437133, 148DIG72, H01L 21265

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active

053895541

ABSTRACT:
In one form of the invention, an emitter structure for a bipolar transistor is disclosed. The structure is comprised of an emitter layer 6 of Al.sub.x Ga.sub.1-x As, where x>0.4, abutting a base layer 8.

REFERENCES:
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patent: 4751195 (1988-06-01), Kawai
patent: 4996166 (1991-02-01), Ohshima
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P. Launay, B. Bamueni, A. Duchenois, P. Blanconnier, "Self-Aligned AlGaAs/GaAs HBT's with Tungsten N and P type Ohmic Contacts", Microelectronic Engineering, vol. 15, No. 1/4, Oct. 1991, pp. 161-164.
A. Lahav and M. Genut, "Study of Tungsten and WSi Refractory Ohmic Contacts to Graded-Gap InGaAs/GaAs/AlGaAs Heterostructures", Materials Science and Engineering, vol. B7, No. 3, Dec. 1990, pp. 231-235.
Guan-bo Gao, et al., "emitter Ballasting Resistor Design for, and Current Handling Capability of AlGaAs/GaAs Power Heterojunction Bipolar Transistors", IEEE Transactions on Electron Devices, vol. 38, No. 2, pp. 185-196, Feb. 1991.
Richard H. Winkler, "Thermal Properties of High-Power Transistors", IEEE Transactions on Electron Devices, vol. ED-14, No. 5, pp. 260-263, May 1967.
Robert P. Arnold, et al., "A Quantitative Study of Emitter Ballasting", IEEE Transactions on Electron Devices, vol. ED-21, No. 7, pp. 385-391, Jul. 1974.
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"500mA AlGaAs/GaAs Power Heterojunction Bipolar Transistor", Electronics Letters, vol. 25, No. 21, pp. 1447-1448, Oct. 12, 1989.

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