Method for fabricating micro-structures with various surface...

Etching a substrate: processes – Forming groove or hole in a substrate which is subsequently...

Reexamination Certificate

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C216S065000, C216S067000

Reexamination Certificate

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07087181

ABSTRACT:
The technology is based on the anisotropic plasma etching of organic polymer sheets partially protected by a metallic mask. The originality of the process is to pattern the surface properties by the same physical means as the one used for the three dimensional fabrication and simultaneously to this fabrication. Surface properties means, but are not limited to hydrophobicity, hydrophilicity, conductivity, reflectability, rugosity and more precisely the chemical and/or physical state of the surface. It is also possible to generate the desired fonctionalities, for instance carboxylic acid, ester, ether, amid or imid, during the etching process. The patterning of the different properties may be achieved by two different techniques that may be used separately or simultaneously.

REFERENCES:
patent: 5992820 (1999-11-01), Fare et al.
patent: 6103199 (2000-08-01), Bjornson et al.
patent: 6355491 (2002-03-01), Zhou et al.
patent: 6423465 (2002-07-01), Hawker et al.
patent: 6756019 (2004-06-01), Dubrow et al.
patent: 2003/0113528 (2003-06-01), Moya
patent: 2004/0115833 (2004-06-01), Sudor
patent: WO 92 15408 (1992-09-01), None
International Preliminary Examination Report datedMay 27, 2002.

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