Method for fabricating metallized ceramics substrate,...

Details Method for fabricating metallized ceramics substrate,... Method for fabricating metallized ceramics substrate,...

2007-01-23

2011-12-06

Loney, Donald J (Department: 1783)

Stock material or miscellaneous articles

Hollow or container type article

Glass, ceramic, or sintered, fused, fired, or calcined metal...

C428S209000, C428S210000, C428S212000, C428S409000, C361S730000, C361S752000, C361S811000, C361S820000, C257S676000, C257S703000, C257S704000

Reexamination Certificate

active

08071187

ABSTRACT:
A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

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European Search Report PCT/JP2007050940.
International Search Report: PCT/JP2007/050940.

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