Method for fabricating metal wires

Details Method for fabricating metal wires Method for fabricating metal wires

2005-09-28

2010-02-23

Nguyen, Nam X (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S125000

Reexamination Certificate

active

07666291

ABSTRACT:
A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially exposed. Next, an electroplating process is performed to form a second metal layer on top of the partially exposed first metal layer. Next, the mask with patterns is removed and an etching process is performed to remove part of the first metal layer by utilizing the second metal layer as a mask for forming a metal wire.

REFERENCES:
patent: 4640739 (1987-02-01), Modic
patent: 6015482 (2000-01-01), Stern
patent: 6319741 (2001-11-01), Izumi et al.
patent: 1086372 (1994-05-01), None
patent: 1412836 (2003-04-01), None

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