Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-05-09
2006-05-09
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S166000, C438S482000, C438S486000
Reexamination Certificate
active
07041520
ABSTRACT:
A method for fabricating LCDs based on a plastic film is disclosed. The disclosed method comprise the steps of: attaching a double-sided adhesive tape to a supporting plate using one side thereof; fixing a plastic film substrate onto the supporting plate using an unused side of the double-sided adhesive tape after putting the plastic film substrate and the supporting plate with the double-sided adhesive tape attached thereto through a predetermined thermal treatment to thereby form a lower substrate including the supporting plate, plastic film substrate and the double-sided adhesive tape therebetween; preparing an upper substrate using the steps described above; conducting a substrate forming process on each of the lower and the upper substrates; depositing an orientation film on both the lower substrate and the upper substrate, and rubbing the orientation film; detaching the plastic film substrate from the supporting plate of the lower and the upper substrates to form a plastic front substrate and a plastic rear substrate; spraying spacer particles on one of the plastic front substrate and the plastic rear substrate, and dispensing a sealant on the other substrate; and joining the plastic front substrate and the plastic rear substrate at a distance, injecting a liquid crystal material through an injection opening, and closing the injection opening to thereby form a plastic film liquid crystal display.
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English language Abstract of JP 11-212116, Published Aug. 6, 1999.
Hwang Won mi
Jeong Jong han
Greenblum & Bernstein P.L.C.
Picardat Kevin M.
Softpixel, Inc.
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