Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2008-01-29
2010-06-01
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C438S022000, C438S026000, C438S034000, C438S458000, C438S481000, C257SE21121
Reexamination Certificate
active
07727790
ABSTRACT:
The invention is method for fabricating light emitting diodes. A layered semiconductor structure is provided on a growth substrate. The method includes using a pulsed laser to form an interfacial layer between the layered semiconductor structure and the growth substrate for subsequent substrate detachment and to simultaneously form light extracting elements on the layered semiconductor structure. The method reduces the number of steps required to fabricate a light emitting diode.
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Beeson Karl W.
Livesay William R.
Rose Richard L.
Zimmerman Scott M.
Goldeneye, Inc.
Lee Kyoung
Propp, Esq William
Richards N Drew
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