Method for fabricating light emitting diode element

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing

Reexamination Certificate

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C438S034000, C438S041000, C438S751000, C438S945000, C257SE21306, C257SE21034, C257SE21117

Reexamination Certificate

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07579202

ABSTRACT:
The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and form side-protrudent structures, whereby the LED epitaxial layers have non-rectangular inclines, which can solve the problem of total reflection and promote light-extraction efficiency. Further, the method of the present invention has a simple fabrication process, which can benefit mass production and lower cost.

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patent: 2005/0156180 (2005-07-01), Zhang et al.
patent: 2006/0033119 (2006-02-01), Shibata
patent: 2007/0166851 (2007-07-01), Tran et al.
patent: 2008/0014723 (2008-01-01), Shibata

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