Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2007-12-21
2009-08-25
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C438S034000, C438S041000, C438S751000, C438S945000, C257SE21306, C257SE21034, C257SE21117
Reexamination Certificate
active
07579202
ABSTRACT:
The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and form side-protrudent structures, whereby the LED epitaxial layers have non-rectangular inclines, which can solve the problem of total reflection and promote light-extraction efficiency. Further, the method of the present invention has a simple fabrication process, which can benefit mass production and lower cost.
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Fu Jenn-Hwa
Hsu Wen-Chieh
Lee Shih-Hung
Liu Yu-Chuan
Wang Tai-Chun
Everhart Caridad M
Muncy Geissler Olds & Lowe, PLLC
Tekcore Co., Ltd.
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