Method for fabricating light-emitting devices utilizing a...

Details Method for fabricating light-emitting devices utilizing a... Method for fabricating light-emitting devices utilizing a...

2006-10-03

2006-10-03

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S106000, C438S126000, C438S795000

Reexamination Certificate

active

07115428

ABSTRACT:
A method for fabricating a light-emitting device is disclosed. A die that includes a semiconductor light emitting device is mounted on a carrier, the die having a face through which light is emitted. A mixture of photocurable epoxy and phosphor particles is dispensed on the face in a pattern that covers the face. The dispensed mixture is then irradiated with light to cure the epoxy in a time period that is less than the time period in which the phosphor particles settle. In one embodiment, the photocurable epoxy includes a UV curable epoxy. In one embodiment, the die includes sides through which some of the light is emitted and the mixture is allowed to run down the sides prior to being irradiated.

REFERENCES:
patent: 5905012 (1999-05-01), De Meutter et al.
patent: 6806658 (2004-10-01), Tan et al.
patent: 2003/0001140 (2003-01-01), Starkey
patent: 2004/0018379 (2004-01-01), Kinlen
patent: 2004/0166234 (2004-08-01), Chua et al.
patent: 2004/0212295 (2004-10-01), Chua et al.

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