Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2009-08-05
2011-12-06
Lee, Cheung (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S030000, C438S044000, C438S069000, C257SE21033, C257SE21527
Reexamination Certificate
active
08071404
ABSTRACT:
By using a first substrate which has a light-transmitting property and whose first face is provided with a light-absorbing layer, a mixture including an organic compound and an inorganic material is irradiated with light having a wavelength, which is absorbed by the inorganic material to heat the mixture, and thereby a film of the organic compound included in the mixture is formed on the first face of the first substrate. Then, the first face of the first substrate and a deposition surface of a second substrate are arranged to be adjacent to or in contact with each other, irradiation with light having a wavelength, which is absorbed by the light-absorbing layer is conducted from a second face side of the first substrate, to heat the organic compound, and thereby at least part of the organic compound is formed as a film on the deposition surface of the second substrate.
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Ikeda Hisao
Seo Satoshi
Tanaka Koichiro
Yamazaki Shunpei
Husch & Blackwell LLP
Lee Cheung
Semiconductor Energy Laboratory Co,. Ltd.
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