Method for fabricating LCD substrates having solderable die atta

Details Method for fabricating LCD substrates having solderable die atta Method for fabricating LCD substrates having solderable die atta

1995-07-17

1996-06-25

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Liquid crystal process, composition, or product

430314, 430319, 427109, 4271262, 4271263, 359 72, 359 74, 359 75, 359 76, C09K 1900

Patent

active

055298630

ABSTRACT:
A method for fabricating solderable pads (106) onto a glass substrate (101) includes the step of depositing a seed metallization layer (step 406) after the polyimide layer is cured (step 404) but prior to buffing the alignment layer (step 414). The seed metallization layer can done by, for example, sputter depositing indium-tin, tin or copper.

REFERENCES:
patent: 4188095 (1980-02-01), Nishimura et al.
patent: 4643526 (1987-02-01), Watanabe et al.
patent: 4917466 (1990-04-01), Nakamura et al.
patent: 5169737 (1992-12-01), Haws
patent: 5338240 (1994-08-01), Kim

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