Method for fabricating large capacity NAND type ROM with short m

Fishing – trapping – and vermin destroying

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437 44, 437984, H01L 218246

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active

056100922

ABSTRACT:
A NAND type mask ROM having a gate length of one half micron or below is disclosed. For the fabrication of this device, gate electrodes are formed on a gate insulating film which is on a P-type silicon substrate and in which a memory cell region and a peripheral transistor are separately defined by a field oxide film. Then, N.sup.- -type diffusion layers are formed, and then an insulating layer is deposited by a biased ECRCVD process. The insulating film is not formed on edges of the memory cell gate electrodes so that, when the entire surface of the insulating film is etched-back, side walls are formed only in the peripheral transistor region. By subsequently forming N.sup.+ -type diffusion layers, N-channel cell transistors and an N-channel LDD transistor 11 are formed in a self-aligned form. The resulting structure permits increasing memory cell transistor "on" current without increasing the number of steps and number of masks.

REFERENCES:
patent: 4565712 (1986-01-01), Noguchi et al.
patent: 5429967 (1995-07-01), Hong
patent: 5470774 (1995-11-01), Kunitou
patent: 5514611 (1996-05-01), Kim et al.

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