Method for fabricating hybrid integrated circuit

Details Method for fabricating hybrid integrated circuit Method for fabricating hybrid integrated circuit

1989-08-17

1990-08-07

Gorski, Joseph M.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29620, 4271262, H01C 1706

Patent

active

049467093

ABSTRACT:
A method for fabricating a hybrid IC substrate comprises the steps of: preparing an insulating ceramic substrate having a major surface; baking one or more conductors of a first group formed of high melting point metal or alloy thereof on the major surface; covering the conductors of the first group with a first plated film formed by electroless plating; forming an insulating porous active including a glass component and a small amount of a metal component having a catalytic action for electroless plating on the first plated film; and forming one or more conductors of a second group by electroless plating on the active layer, whereby portions of the active layer sandwiched between the conductors of the first and second groups are rendered conductive.

REFERENCES:
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patent: 3648363 (1972-03-01), Buzard et al.
patent: 3725743 (1973-04-01), Murayama
patent: 3725836 (1973-04-01), Wada et al.
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patent: 4464420 (1984-08-01), Taguchi et al.
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patent: 4651126 (1987-03-01), Kumar et al.
patent: 4685203 (1987-08-01), Takada et al.
patent: 4742362 (1988-05-01), Takoshima et al.
Co-pending U.S. Patent Application No. 825,996 Entitled "Method for Producing Hybrid Integrated Circuit Substrate".

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