Method for fabricating highly reliable interconnects

Details Method for fabricating highly reliable interconnects Method for fabricating highly reliable interconnects

2011-07-12

2011-07-12

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S906000, C257SE21230, C414S935000

Reexamination Certificate

active

07977241

ABSTRACT:
A method of fabricating highly reliable tungsten interconnects takes into consideration the effects of charging that can occur within a CMP apparatus due to unrestricted DI water flow, limited only by house supply. Such effects are addressed with the use of a variable pressure input constant flow output in-line controller to the DI water line coupled to the head cleaning loading and unloading module of the CMP apparatus.

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